基本信息:
- 专利标题： 금속 수지 복합체
- 专利标题（英）：Metal-resin composite
- 专利标题（中）：金属树脂复合材料
- 申请号：KR1020127019735 申请日：2011-01-27
- 公开(公告)号：KR1020120112657A 公开(公告)日：2012-10-11
- 发明人： 니시우라가츠노리 , 도리이다마사히로 , 야마시타와타루
- 申请人： 미쓰이 가가쿠 가부시키가이샤
- 申请人地址： *-*-*, Higashi-Shimbashi, Minato-ku, Tokyo, Japan
- 专利权人： 미쓰이 가가쿠 가부시키가이샤
- 当前专利权人： 미쓰이 가가쿠 가부시키가이샤
- 当前专利权人地址： *-*-*, Higashi-Shimbashi, Minato-ku, Tokyo, Japan
- 代理人： 제일특허법인
- 优先权： JPJP-P-2010-016989 2010-01-28
- 国际申请： PCT/JP2011/000450 2011-01-27
- 国际公布： WO2011093079 2011-08-04
- 主分类号： C08L101/12
- IPC分类号： C08L101/12 ; B32B15/08 ; C08L23/00 ; H01B7/17
An object of the present invention is a low dielectric constant or dielectric loss tangent to also have a layer made of a heat-resistant resin composition a small coefficient of thermal expansion, providing a metal-resin composite transmission loss reduction of the electrical signal. The present invention provides a metal-resin composite having a resin layer (I) in contact through the metal, the metal directly or the intermediate layer, the resin layer (I) is greater than the dielectric constant at a frequency of 1MHz 2.3 heat-resistant resin (A) and the average particle diameter is obtained from the resin composition obtained by mixing polyolefin particles (B) not more than 100㎛, the resin composition has a dispersed phase obtained from the continuous phase and the polyolefin particles (B) of the heat-resistant resin (a), in addition, the relative dielectric constant of the resin composition is lower than the heat-resistant resin (a).
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08L | 高分子化合物的组合物 |
| ------C08L101/00 | 未指明的高分子化合物的组合物 |
| --------C08L101/12 | .以物理性能（例如各向异性、黏度、电导性）为特征 |