基本信息:
- 专利标题: 적외선 검출기를 생산하기 위한 방법
- 专利标题(英):Method for producing an infrared light detector
- 专利标题(中):生产红外光探测器的方法
- 申请号:KR1020127019465 申请日:2010-12-21
- 公开(公告)号:KR1020120097408A 公开(公告)日:2012-09-03
- 发明人: 레어드,론 , 프리본,스콧 , 스튜어트,아치,쇼
- 申请人: 파이레오스 엘티디.
- 申请人地址: The Kings Buildings, Scottish Microelectronics Centre, West Mains Road, Edinburgh EH* *JF, United Kingdom
- 专利权人: 파이레오스 엘티디.
- 当前专利权人: 파이레오스 엘티디.
- 当前专利权人地址: The Kings Buildings, Scottish Microelectronics Centre, West Mains Road, Edinburgh EH* *JF, United Kingdom
- 代理人: 특허법인 남앤드남
- 优先权: DE10 2009 060 2178 2009-12-23
- 国际申请: PCT/EP2010/070372 2010-12-21
- 国际公布: WO2011076788 2011-06-30
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H05K3/34 ; H01L23/00 ; H01L31/0203
A method for manufacturing an infrared detector (1), comprising: providing a plurality of connection pins 11 and 12? The plurality of connecting pins are held together side by side one of the longitudinal ends (17. 18) of the plurality of connection pins are arranged in a horizontal plane (horizontal plane), a printed circuit board (6) is the lower side in each case of the recess (15, 16) is connected to the pins (11, 12) having a flat bottom side 8 is provided for each?; Filling the recesses (15, 16), the same amount of solder paste body 21 having a solder paste to be present in each of the recesses (15, 16) of a solder paste; The solder paste and extending from the recess (15, 16) assigned to the connecting pins, the vertical end (17, 18) of each of said connecting pins (11, 12) located in the respective recess (15, 16) positioning a printed circuit board (6) over the connecting pins (11, 12) to lock the body (21); The step of liquefying the solder paste body (21)? The electrically conductive connection by are due to the weight of the connection pins (11, 12) and the solder paste body (21) is formed between the solder paste body (21), surface tension, and a printed circuit board (6) of, the lower side 8 of the printed circuit board (6) being oriented in parallel to the horizontal plane? .; The solder paste including the step of solidifying the body (21), the printed circuit board 6 and the connecting pins rigid mechanically connected by a between the solder paste body 21 (11, 12) are formed in the printed circuit board the orientation of the lower side 8 of the layer 6 is fixed in parallel to the horizontal plane.
公开/授权文献:
- KR101787548B1 적외선 검출기를 생산하기 위한 방법 公开/授权日:2017-10-18
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L27/00 | 由在一个共用衬底内或其上形成的多个半导体或其他固态组件组成的器件 |
--------H01L27/02 | .包括有专门适用于整流、振荡、放大或切换的半导体组件并且至少有一个电位跃变势垒或者表面势垒的;包括至少有一个跃变势垒或者表面势垒的无源集成电路单元的 |
----------H01L27/144 | ..由辐射控制的器件 |
------------H01L27/146 | ...图像结构 |