基本信息:
- 专利标题: 전자 장치의 제조 방법, 전자 장치 및 전자 장치의 제조 장치
- 专利标题(英):Process for production of electronic device, electronic device, and device for production of electronic device
- 专利标题(中):用于生产电子设备的方法,电子设备和用于生产电子设备的设备
- 申请号:KR1020127012776 申请日:2010-10-13
- 公开(公告)号:KR1020120095925A 公开(公告)日:2012-08-29
- 发明人: 메우라도루 , 니카이도히로키 , 마에지마겐조우 , 이시무라요지 , 요시다겐지
- 申请人: 스미또모 베이크라이트 가부시키가이샤
- 申请人地址: 일본 도쿄도 시나가와꾸 히가시시나가와 *쵸메 *방 *고
- 专利权人: 스미또모 베이크라이트 가부시키가이샤
- 当前专利权人: 스미또모 베이크라이트 가부시키가이샤
- 当前专利权人地址: 일본 도쿄도 시나가와꾸 히가시시나가와 *쵸메 *방 *고
- 代理人: 특허법인코리아나
- 优先权: JPJP-P-2009-240409 2009-10-19; JPJP-P-2010-055329 2010-03-12; JPJP-P-2010-080453 2010-03-31
- 国际申请: PCT/JP2010/006071 2010-10-13
- 国际公布: WO2011048774 2011-04-28
- 主分类号: H01L21/60
- IPC分类号: H01L21/60 ; H01L25/18
Method of manufacturing an electronic device is resin layer containing a second terminal 21, the flux activity compound and a thermosetting resin between the first terminal 11 and the second electronic component (2) of the first electronic component (1) ( 3) the arrangement to heat the stacked body 4, the layered product (4) while pressing the by step, the fluid to obtain a layered product (4) above the melting point of the solder layer 112 of the first terminal 11 and, a first terminal 11 and second terminal 21 and a step of curing the solder bonding step, a resin layer 3 which. First up to the melting point of the first terminal 11 and the second in the step of soldering the terminal 21, the layered product (4) heated from immediately after the start of the layered product (4) the solder layer 112 is a temperature of the and the time to more than 5 seconds, less than 15 minutes.
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
--------------H01L21/60 | ....引线或其他导电构件的连接,用于工作时向或由器件传导电流 |