发明公开
KR1020120079084A 방사선 방출면 및 절연 층을 갖는 적어도 하나의 제 1 반도체 몸체를 포함하는 광전자 모듈 그리고 상기 광전자 모듈을 제조하기 위한 방법
无效 - Rejected
基本信息:
- 专利标题： 방사선 방출면 및 절연 층을 갖는 적어도 하나의 제 1 반도체 몸체를 포함하는 광전자 모듈 그리고 상기 광전자 모듈을 제조하기 위한 방법
- 专利标题（英）：Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof
- 专利标题（中）：具有至少一个具有辐射出口侧和绝缘层的第一半导体体的光电模块及其生产方法
- 申请号：KR1020127008659 申请日：2010-08-06
- 公开(公告)号：KR1020120079084A 公开(公告)日：2012-07-11
- 发明人： 바이트너,카를 , 비르트,랄프 , 칼텐바허,악셀 , 베크라이터,발터 , 바르히만,베른트 , 부츠,올리버 , 마르펠트,얀
- 申请人： 오스람 옵토 세미컨덕터스 게엠베하
- 申请人地址： Leibnizstrasse *, ***** Regensburg, Germany
- 专利权人： 오스람 옵토 세미컨덕터스 게엠베하
- 当前专利权人： 오스람 옵토 세미컨덕터스 게엠베하
- 当前专利权人地址： Leibnizstrasse *, ***** Regensburg, Germany
- 代理人： 특허법인 남앤드남
- 优先权： DE10 2009 039 8910 2009-09-03
- 国际申请： PCT/DE2010/000944 2010-08-06
- 国际公布： WO2011026456 2011-03-10
- 主分类号： H01L33/48
- IPC分类号： H01L33/48 ; H01L33/44 ; H05K3/28 ; H01L33/62
The present invention relates to an optoelectronic module, the optoelectronic module includes a first semiconductor body (2) having a radiation-emitting in electric connection areas (21, 22) are arranged on the surface (2a). The first semiconductor body (2) is disposed on a carrier (1) with the side lying opposite the radiation emission surface (2a). Wherein the on-carrier (1) the side next to the first semiconductor body (2) is disposed an insulation material 3, the insulating material in a shape-coupled to form a fillet (fillet) on the semiconductor body (2) adjacent. The first semiconductor body (2) and insulating material (3) formed on and at least the local insulating layer 4 is arranged, the electrical connection areas for the flat contact putting of the first semiconductor body (2) formed on the insulating layer ( 21, 22) and is a flat conductor structure is arranged in connection with challenging. The present invention also relates to a method for the production of optoelectronic modules, such as described above.