基本信息:
- 专利标题： 전극의 접속 방법 및 그것에 사용되는 접속 조성물
- 专利标题（英）：Method for connecting electrodes and connection composition used therefor
- 专利标题（中）：用于连接电极的方法及其连接组合物
- 申请号：KR1020127004682 申请日：2010-07-22
- 公开(公告)号：KR1020120034244A 公开(公告)日：2012-04-10
- 发明人： 이다,가즈토시 , 첸,춘푸
- 申请人： 헨켈 코포레이션
- 申请人地址： One Henkel Way, Rocky Hill, CT *****, U.S.A.
- 专利权人： 헨켈 코포레이션
- 当前专利权人： 헨켈 코포레이션
- 当前专利权人地址： One Henkel Way, Rocky Hill, CT *****, U.S.A.
- 代理人： 양영준; 이귀동
- 优先权： JPJP-P-2009-173085 2009-07-24
- 国际申请： PCT/JP2010/062346 2010-07-22
- 国际公布： WO2011010692 2011-01-27
- 主分类号： H05K3/36
- IPC分类号： H05K3/36 ; H05K1/14 ; G09F9/00 ; G02F1/1345
In the present invention, the method of connecting the electrode and a second electrode 12 formed on the first connection portion and a flexible substrate 11 which includes a first electrode 11 formed on the transparent substrate 21, , together with also bond the second connection, a method for electrically connecting the first electrode and the second electrode, the at least one of the first connection and the second connection portion (a) a curable resin component and (b) optical containing curing starting components and also before the first light irradiation step and the connecting composition to light irradiation in the process, the connecting composition applied for coating the connection composition having a delayed curing by light irradiation (13, 14) hardening, wherein aligning the position of the second electrode and the first electrode and the first connection portion and a pressure to each other and the second connecting portion, and also has a second light irradiation step of light irradiation.
公开/授权文献:
- KR101393857B1 전극의 접속 방법 및 그것에 사용되는 접속 조성물 公开/授权日：2014-05-12
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/36 | .印刷电路与其他印刷电路的组装 |