基本信息:
- 专利标题: 질화물계 반도체 소자 및 그 제조 방법
- 专利标题(英):Nitride based semiconductor device and method for manufacturing the same
- 专利标题(中):基于氮化物的半导体器件及其制造方法
- 申请号:KR1020100065422 申请日:2010-07-07
- 公开(公告)号:KR1020120004758A 公开(公告)日:2012-01-13
- 发明人: 전우철 , 박기열 , 이정희 , 박영환
- 申请人: 삼성전기주식회사
- 申请人地址: Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 专利权人: 삼성전기주식회사
- 当前专利权人: 삼성전기주식회사
- 当前专利权人地址: Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 代理人: 김창달
- 主分类号: H01L29/808
- IPC分类号: H01L29/808 ; H01L21/337
摘要:
PURPOSE: A nitride based semiconductor device and a method for manufacturing thereof are provided to increase the mass production efficiency of a semiconductor device with the increase of reverse internal pressure in a device by preventing a reverse leak current. CONSTITUTION: A base substrate(110) is formed into a PN junction structure. The base substrate is formed by welding a first type semiconductor layer(112) and a second type semiconductor layer(114) to the top and bottom. A buffer layer(118) is formed on the base substrate. The buffer layer reduces defect due to lattice mismatch between the base substrate and an epitaxial-growth film(120). The epitaxial-growth film includes a first nitride film(122) and a second nitride film(124) which are successively laminated on the base substrate.
摘要(中):
目的:提供一种氮化物基半导体器件及其制造方法,通过防止反向泄漏电流,通过设备中的反向内部压力的增加来提高半导体器件的批量生产效率。 构成:基底(110)形成为PN结结构。 基底基板通过将第一类型半导体层(112)和第二类型半导体层(114)焊接到顶部和底部而形成。 在基底基板上形成缓冲层(118)。 缓冲层减少由于基底衬底和外延生长膜(120)之间的晶格失配引起的缺陷。 外延生长膜包括依次层压在基底基板上的第一氮化物膜(122)和第二氮化物膜(124)。
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L29/00 | 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件 |
--------H01L29/02 | .按其半导体本体的特征区分的 |
----------H01L29/68 | ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的 |
------------H01L29/70 | ...双极器件 |
--------------H01L29/762 | ....电荷转移器件 |
----------------H01L29/78 | .....由绝缘栅产生场效应的 |
------------------H01L29/808 | ......带有PN结栅的 |