基本信息:
- 专利标题： 양면 연삭 기계에서 매우 얇은 작업물을 재료 제거 가공하기 위한 방법
- 专利标题（英）：Method for the material-removing machining of very thin work pieces in a double side grinding machine
- 专利标题（中）：在双面磨床中进行非常薄的加工的材料的方法
- 申请号：KR1020117023576 申请日：2010-04-01
- 公开(公告)号：KR1020110135401A 公开(公告)日：2011-12-16
- 发明人： 룬켈프랭크
- 申请人： 페터 볼터스 게엠베하
- 申请人地址： Buesumer Str. **, *****, Rendsburg, GERMANY
- 专利权人： 페터 볼터스 게엠베하
- 当前专利权人： 페터 볼터스 게엠베하
- 当前专利权人地址： Buesumer Str. **, *****, Rendsburg, GERMANY
- 代理人： 유미특허법인
- 优先权： DE10 2009 015 8782 2009-04-01
- 国际申请： PCT/EP2010/002090 2010-04-01
- 国际公布： WO2010112225 2010-10-07
- 主分类号： B24B7/17
- IPC分类号： B24B7/17 ; B24B37/28 ; B24B49/12 ; B24B7/22 ; H01L21/304
The present invention relates to a highly planar workpiece (38) is fixed removably on a flat carrier (28) A method for grinding or polishing process. Workpiece 38 along the cycloidal path between the working surfaces of the both-side grinding machine (10) is inserted into the carrier groove (23) of the at least one rotor disc (22) of the double-sided grinding machine (10) with 28 It is moved. Removal of the work surfaces of the both-side grinding machine 10 are the same or, in the removal of a processing surface is not less than or is substantially, or material removed from a work surface is performed from the opposite side than the removal rate of the work surface. In one embodiment, there is both a workpiece (38) fixed detachably to the carrier 28, that is secured to the upper and lower surfaces.
公开/授权文献:
- KR101760355B1 양면 연삭 기계에서 매우 얇은 작업물을 재료 제거 가공하기 위한 방법 公开/授权日：2017-07-21
信息查询:
EspacenetIPC结构图谱:
| B | 作业；运输 |
| --B24 | 磨削；抛光 |
| ----B24B | 用于磨削或抛光的机床、装置或工艺；磨具磨损表面的修理或调节；磨削，抛光剂或研磨剂的进给 |
| ------B24B7/00 | 适用于磨削工件平面的机床或装置，包括抛光平面玻璃表面；及其附件 |
| --------B24B7/07 | .使用固定工作台的 |
| ----------B24B7/16 | ..用于磨削端面；如量规，辊柱，螺帽，活塞环的端面 |
| ------------B24B7/17 | ...用于同时磨削对置和平行端面的，如双盘磨床 |