A thin film superconducting wire to form a copper plating thin film on the surface of the multilayer structure, the bending property is deteriorated as compared to the thin-film superconducting wire is not formed in the copper plating thin film. So, in order to suppress the deterioration of the bending property, the thin-film superconducting wire 10 of the present invention, the substrate (1), and an intermediate layer 3 formed on one major surface of the substrate 1, the intermediate layer 3 of a thin-film superconducting wire 10 having the substrate 1 and the layered structure (20) including a superconducting layer 5 formed on the side opposite to the main surface of the main surface facing. And further comprising a copper plating thin film (9) covering the outer periphery of the laminated structure 20, the copper plating thin film (9) has a residual stress is a compressive stress therein. The laminated structure (20) is the silver coating layer 7 in between, which covers the outer periphery of the laminated structure 20 of the sputter layer (6) provided, may be the copper plating thin film 9 and the multilayer structure 20 there may be further provided.