基本信息:
- 专利标题： 인쇄 회로 조립체
- 专利标题（英）：Printed circuit assembly
- 专利标题（中）：印刷电路总成
- 申请号：KR1020117020361 申请日：2010-02-01
- 公开(公告)号：KR1020110122159A 公开(公告)日：2011-11-09
- 发明人： 스메텍달리보르제이.
- 申请人： 티이 커넥티비티 코포레이션
- 申请人地址： **** Westlakes Drive, Berwyn, PA *****, U.S.A.
- 专利权人： 티이 커넥티비티 코포레이션
- 当前专利权人： 티이 커넥티비티 코포레이션
- 当前专利权人地址： **** Westlakes Drive, Berwyn, PA *****, U.S.A.
- 代理人： 양영준; 안국찬
- 优先权： US12/364,333 2009-02-02
- 国际申请： PCT/US2010/000277 2010-02-01
- 国际公布： WO2010087996 2010-08-05
- 主分类号： H05K1/14
- IPC分类号： H05K1/14 ; H05K3/36
A printed circuit assembly 10 comprises a base printed circuit 12 having a plurality of electrical contacts 30 provided on the printed circuit receiving area 29 and the printed circuit receiving area. Printed circuit assembly also includes a fastening edge 46 and the secondary fastening the printed circuit (14) comprising a secondary substrate (54) including a plurality of second contact portion 70 is provided along the edge. The second printed circuit is a fastening edge of the second printed circuit is mounted on the base so as to engage directly with the printed circuit on the receiving areas printed circuit base printed circuit. The second contact portions each of which is electrically connected to a corresponding electrical contact of the base printed circuit.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/14 | ..两个或更多个印刷电路的结构连接 |