基本信息:
- 专利标题: 조명 장치 및 그 제조 방법
- 专利标题(英):Illumination device and method for manufacturing the same
- 专利标题(中):照明装置及其制造方法
- 申请号:KR1020117011894 申请日:2009-11-26
- 公开(公告)号:KR1020110102311A 公开(公告)日:2011-09-16
- 发明人: 요네다겐지 , 미우라겐지
- 申请人: 씨씨에스 가부시키가이샤
- 申请人地址: ***, Okakuencho, Shimodachiuri-agaru, Karasumadori, Kamigyo-ku, Kyoto-shi, Kyoto ***-**** Japan
- 专利权人: 씨씨에스 가부시키가이샤
- 当前专利权人: 씨씨에스 가부시키가이샤
- 当前专利权人地址: ***, Okakuencho, Shimodachiuri-agaru, Karasumadori, Kamigyo-ku, Kyoto-shi, Kyoto ***-**** Japan
- 代理人: 특허법인태평양
- 优先权: JPJP-P-2008-301532 2008-11-26
- 国际申请: PCT/JP2009/069900 2009-11-26
- 国际公布: WO2010061868 2010-06-03
- 主分类号: F21S2/00
- IPC分类号: F21S2/00 ; F21V19/00 ; F21Y101/02
The invention, while using the chip-type LED of surface mount type, a wiring substrate is a method for easily manufacturing the lighting device or lighting device formed in a truncated cone shape, etc., of the strip forming the flexible part annular or linear with a castle Preparation of the mounting box and, at the same time, a lighting device (1) forming said circuit board (2) to be rounded so that its short side to each other abut the truncated cone-shaped or cylindrical the chip-type LED (1) to the surface of the circuit board (2) a method, according to the printed board (2), providing a through-hole (T) for the solder paste (S) filled in the wiring end portion (L) that the terminal 12 is connected to the LED (1) and the flat plate-like the temporary fixing by the LED (1) for holding a said wiring board (2) to the adhesive (B) hereinafter and, at the same time, and the back surface of the circuit board (2) filling a solder paste (S) into the through-hole (T), is equipped with a LED (1), in addition, solder paste in the through-hole (T) Bit by (S) is rounded to the filled circuit board (2) with the shape, a ripple circuit board (2) in its low state, and soldering the LED (1).
信息查询:
EspacenetIPC结构图谱:
F | 机械工程;照明;加热;武器;爆破 |
--F21 | 照明 |
----F21S | 非便携式照明装置或其系统 |
------F21S2/00 | 照明装置的系统,没有包含在大组F21S4/00至F21S10/00中,例如积木式结构的 |