基本信息:
- 专利标题: 험한 환경들에 대한 인쇄회로기판
- 专利标题(英):Printed circuit board for harsh environments
- 专利标题(中):印刷电路板的HARH环境
- 申请号:KR1020117007152 申请日:2009-09-03
- 公开(公告)号:KR1020110063787A 公开(公告)日:2011-06-14
- 发明人: 미첼,데이비드,제이. , 쿨카르니,안앤드,에이. , 번스,앤드류,제이.
- 申请人: 지멘스 에너지, 인코포레이티드
- 申请人地址: **** Alafaya Trail, Orlando, FL *****-****, U.S.A.
- 专利权人: 지멘스 에너지, 인코포레이티드
- 当前专利权人: 지멘스 에너지, 인코포레이티드
- 当前专利权人地址: **** Alafaya Trail, Orlando, FL *****-****, U.S.A.
- 代理人: 김미희; 이시용; 정현주
- 优先权: US12/327,348 2008-12-03; US61/100,442 2008-09-26
- 国际申请: PCT/US2009/055801 2009-09-03
- 国际公布: WO2010036496 2010-04-01
- 主分类号: H05K3/00
- IPC分类号: H05K3/00 ; H05K7/00 ; H01L21/48
The present invention relates to a gas turbine 11, as the extremely high G force (G force) and the second print circuit board to withstand the high temperature (PCB) (22). The PCB includes a conductor which is embedded in the PCB to electrically connect the components together in order to complete the substrate, and a circuit having a plurality of cavities (30A, 36A) formed therein for receiving the components of the circuit. Each cavity may have a direct contact with the upstream-side direction of the G- forces for supporting the respective wall component (36A ') in order to prevent the deployment of the tension rod within the bonding layer (37A). When the component is an integrated circuit 50, it is coupled between the titanium conductors (63) are contact pads on the exposed end of an inserted conductor and an integrated circuit. Gold paste 51 may be inserted into the clearance gaps between the integrated circuit and the upstream side wall.
公开/授权文献:
- KR101263312B1 험한 환경들에 대한 인쇄회로기판 公开/授权日:2013-05-16
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |