基本信息:
- 专利标题: 기판 처리 장치 및 기판 배치대
- 专利标题(英):Substrate processing apparatus and substrate placing table
- 专利标题(中):基板加工装置和基板放置表
- 申请号:KR1020117005464 申请日:2009-09-16
- 公开(公告)号:KR1020110039495A 公开(公告)日:2011-04-18
- 发明人: 야마시타준
- 申请人: 도쿄엘렉트론가부시키가이샤
- 申请人地址: *-* Akasaka *-chome, Minato-ku, Tokyo, Japan
- 专利权人: 도쿄엘렉트론가부시키가이샤
- 当前专利权人: 도쿄엘렉트론가부시키가이샤
- 当前专利权人地址: *-* Akasaka *-chome, Minato-ku, Tokyo, Japan
- 代理人: 김태홍; 신정건
- 优先权: JPJP-P-2008-236949 2008-09-16; JPJP-P-2008-236950 2008-09-16; JPJP-P-2008-236951 2008-09-16
- 国际申请: PCT/JP2009/066160 2009-09-16
- 国际公布: WO2010032750 2010-03-25
- 主分类号: H01L21/683
- IPC分类号: H01L21/683 ; H01L21/205 ; H01L21/3065
A substrate processing apparatus for processing within the vessel maintained at a vacuum to perform the plasma processing for the substrate (W) includes a substrate mounting table 5 for placing a substrate (W) in the processing vessel. A substrate mounting table (5) is placed against the body made of AlN (51) and, placed against the body and the substrate heater 56 for heating is installed in the (51), placed against the body 51 first of quartz, covering the surface of the 1 the cover 54 and the substrate (W) a plurality of lift pins 52 and, placed against the body 51, a plurality of through holes 53 that lift pin 52 is inserted in to lift the and, the first cover (54) in the through hole 53 and the plurality of openings (54a) formed at a position corresponding to at least some of the through holes of the inner surface of the opening (54a) (53) covers at least a portion of the inner peripheral surface on the first cover (54) from and a second cover 55 made of quartz is installed as a separate member.
公开/授权文献:
- KR101227743B1 기판 처리 장치 및 기판 배치대 公开/授权日:2013-01-29