基本信息:
- 专利标题: 플라즈마 처리 장치
- 专利标题(英):Plasma treatment apparatus
- 专利标题(中):等离子处理设备
- 申请号:KR1020107021754 申请日:2009-03-31
- 公开(公告)号:KR1020100127803A 公开(公告)日:2010-12-06
- 发明人: 나카무라히데오 , 야마시타준 , 기타가와준이치 , 가베요시로 , 후쿠다요시노리
- 申请人: 도쿄엘렉트론가부시키가이샤
- 申请人地址: *-* Akasaka *-chome, Minato-ku, Tokyo, Japan
- 专利权人: 도쿄엘렉트론가부시키가이샤
- 当前专利权人: 도쿄엘렉트론가부시키가이샤
- 当前专利权人地址: *-* Akasaka *-chome, Minato-ku, Tokyo, Japan
- 代理人: 제일특허법인
- 优先权: JPJP-P-2008-092423 2008-03-31; JPJP-P-2008-253930 2008-09-30
- 国际申请: PCT/JP2009/056679 2009-03-31
- 国际公布: WO2009123198 2009-10-08
- 主分类号: H05H1/46
- IPC分类号: H05H1/46 ; H01L21/3065
Of the worktable (5), an electrode 7, a plasma oxidation treatment apparatus (100) to supply the high frequency power for bias embedded in the mounting table (5) features an aluminum cover 27 of which as a counter electrode with respect to the surface exposed to the plasma on the inner periphery, as a protective film is a silicon film 48 is coated. Adjacent to the silicon film 48, the second container (3) and the first container (2) of the inner surface of the top liner (49a) and which is provided with a more lower liner (49b) is formed thicker, a short circuit or at least to these sites discharge is prevented, and appropriate high-frequency current path is formed not be improved power consumption efficiency.
公开/授权文献:
- KR101317018B1 플라즈마 처리 장치 公开/授权日:2013-10-11