基本信息:
- 专利标题： 전기화학 용도에 사용되는 고전기전도성 표면
- 专利标题（英）：Highly electrically conductive surfaces for electrochemical applications
- 专利标题（中）：电化学应用的高电导率表面
- 申请号：KR1020107017499 申请日：2009-01-08
- 公开(公告)号：KR1020100108588A 公开(公告)日：2010-10-07
- 发明人： 왕,종화
- 申请人： 트레드스톤 테크놀로지스, 인크.
- 申请人地址： *** Washington Road, Princeton, New Jersey *****-****, U.S.A.
- 专利权人： 트레드스톤 테크놀로지스, 인크.
- 当前专利权人： 트레드스톤 테크놀로지스, 인크.
- 当前专利权人地址： *** Washington Road, Princeton, New Jersey *****-****, U.S.A.
- 代理人： 양영준; 양영환
- 优先权： US61/019,657 2008-01-08; US61/023,273 2008-01-24; US61/089,233 2008-08-15
- 国际申请： PCT/US2009/030475 2009-01-08
- 国际公布： WO2009089376 2009-07-16
- 主分类号： C23C4/16
- IPC分类号： C23C4/16 ; C23C4/04 ; C23C4/18
The present invention relates to a method that can be used in the electrode for electrochemical devices, which comprises placing the noble metal on the upper surface of the corrosion-resistant metal substrate. The noble metal is thermally sprayed on the surface of the corrosion-resistant metal substrate can make a large number of metal splat. The thermal spray may use a salt solution or a metal particle suspension. It can increase the adhesion of the metal splat on the corrosion resistant metal substrate using a separate bonding process after attaching the metal splat. Splat and associated surface area of the precious metal is less than the surface area associated with the upper surface of the corrosion-resistant metal substrate. Wherein the controlling the thermal spray rates can be achieved within the preferred ratio of the surface area of the metal to the surface area of the splat corrosive metal base.
公开/授权文献:
- KR101559604B1 전기화학 용도에 사용되는 고전기전도성 표면 公开/授权日：2015-10-12