基本信息:
- 专利标题: 메모리 모듈
- 专利标题(英):Three-dimensional memory module architectures
- 专利标题(中):三维存储器模块架构
- 申请号:KR1020107009034 申请日:2008-10-23
- 公开(公告)号:KR1020100095515A 公开(公告)日:2010-08-31
- 发明人: 맥라렌모레이 , 안정호 , 데비이스알란린 , 빈커트나단로렌조 , 쥬피노만폴
- 申请人: 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피.
- 申请人地址: ***** Compaq Center Drive West, Houston, TX *****, United States of America
- 专利权人: 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피.
- 当前专利权人: 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피.
- 当前专利权人地址: ***** Compaq Center Drive West, Houston, TX *****, United States of America
- 代理人: 제일특허법인; 김원준
- 优先权: US11/975,963 2007-10-23
- 国际申请: PCT/US2008/012118 2008-10-23
- 国际公布: WO2009055031 2009-04-30
- 主分类号: G11C5/02
- IPC分类号: G11C5/02
Various embodiments of the present invention relates to a stack-type memory module. In one embodiment of the invention, the memory module (100, 600, 1200, 1400) has at least one memory and at least one memory layer to be laminated - it comprises a control layer (102, 602, 1204, 1202). Fine-pitch of the through vias (e.g. through-silicon via) 114, 116 is at least one of the memory controller through the stack to provide an electronic communication between at least one memory controller (401-404) and at least one memory layer It is substantially perpendicular to the extension of the surface. In addition, the memory-controller layer includes at least one external interface configured to transmit data from the memory module /. In addition, the memory module may include an optical layer (602, 1202). An optical layer can be included in the stack, the waveguide has at least bus transferring data from one memory to the controller /. External interface may be an optical interface for interfacing with an external optical layers.
公开/授权文献:
- KR101574358B1 메모리 모듈 公开/授权日:2015-12-11
信息查询:
EspacenetIPC结构图谱:
G | 物理 |
--G11 | 信息存储 |
----G11C | 静态存储器 |
------G11C5/00 | 包括在G11C11/00组中的存储器零部件 |
--------G11C5/02 | .存储元件的排列,例如,矩阵形式的排列 |