基本信息:
- 专利标题： 웨이퍼 전달 및 열처리가 동시에 수행되는 로드락 챔버
- 专利标题（英）：Loadlock chamber performing a wafer transmission and a heat treatment simultaneously
- 专利标题（中）：负载传感器和热处理同时进行
- 申请号：KR1020090010175 申请日：2009-02-09
- 公开(公告)号：KR1020100090940A 公开(公告)日：2010-08-18
- 发明人： 최형섭 , 박세운
- 申请人： 주식회사 싸이맥스
- 申请人地址： 경기도 화성시 동탄면 동탄산단*길 **
- 专利权人： 주식회사 싸이맥스
- 当前专利权人： 주식회사 싸이맥스
- 当前专利权人地址： 경기도 화성시 동탄면 동탄산단*길 **
- 代理人： 오영균
- 主分类号： H01L21/677
- IPC分类号： H01L21/677 ; H01L21/324
摘要：
PURPOSE: A load-lock chamber is provided to simultaneously perform a wafer transferring process and a thermal treatment process in one module by including a plurality of supporting pads. CONSTITUTION: A wafer is transferred from a wafer transferring unit to a load-lock chamber(200), and the wafer is transferred to a process chamber. The processed wafer is transferred to the load-lock chamber. An upper module(600) includes a first upper wafer supporting pad and a second wafer supporting pad. The second wafer supporting pad is installed between the first upper wafer supporting pad and a first wafer thermal treating unit. A lower module(700) includes a first lower wafer supporting pad and a second wafer supporting pad. The second wafer supporting pad is installed between the first lower wafer supporting pad and a second wafer thermal treating unit.
摘要（中）：
目的：提供一种加载锁定室，以通过包括多个支撑垫来在一个模块中同时执行晶片转移处理和热处理过程。 构成：将晶片从晶片传送单元传送到负载锁定室（200），并将晶片转移到处理室。 经处理的晶片被传送到装载锁定室。 上模块（600）包括第一上晶片支撑垫和第二晶片支撑垫。 第二晶片支撑垫安装在第一上晶片支撑垫和第一晶片热处理单元之间。 下模块（700）包括第一下晶片支撑焊盘和第二晶片支撑焊盘。 第二晶片支撑垫安装在第一下晶片支撑垫和第二晶片热处理单元之间。
公开/授权文献:
- KR101111399B1 웨이퍼 전달 및 열처리가 동시에 수행되는 로드락 챔버 公开/授权日：2012-02-24