基本信息:
- 专利标题: 돌기 전극의 형성 방법 및 치환 금 도금액
- 专利标题(英):Method for forming projection electrode and substituted gold plating solution
- 专利标题(中):用于形成投影电极和取代的镀金解决方案
- 申请号:KR1020090125322 申请日:2009-12-16
- 公开(公告)号:KR1020100070998A 公开(公告)日:2010-06-28
- 发明人: 사와이게이이치 , 아고후지오 , 오다하지메 , 도츠카다카시 , 구즈시마도시오
- 申请人: 샤프 가부시키가이샤 , 니혼 엘렉트로플레이팅 엔지니어스 가부시키가이샤
- 申请人地址: * Takumi-cho, Sakai-ku, Sakai City, Osaka, Japan
- 专利权人: 샤프 가부시키가이샤,니혼 엘렉트로플레이팅 엔지니어스 가부시키가이샤
- 当前专利权人: 샤프 가부시키가이샤,니혼 엘렉트로플레이팅 엔지니어스 가부시키가이샤
- 当前专利权人地址: * Takumi-cho, Sakai-ku, Sakai City, Osaka, Japan
- 代理人: 특허법인코리아나
- 优先权: JPJP-P-2008-322851 2008-12-18
- 主分类号: H01L21/60
- IPC分类号: H01L21/60 ; C23C18/42
摘要:
PURPOSE: A formation method of a projection electrode and a substituted gold plating solution thereof are provided to reduce a manufacturing process of a projection electrode by forming a thickness of a coating film which is sufficient to form a projection electrode with a single coating process. CONSTITUTION: An electrode(12) is formed on a substrate(1). A projection part(21) is formed on the electrode and the insulating layer(11). The projection part is composed of a metal with conductivity. A coating film(22) is formed by using a substituted gold plating solution in the surface of the projection part. The projection part is electrically connected to the electrode.
摘要(中):
目的:提供一种投影电极及其取代金镀液的形成方法,通过形成足以形成具有单次涂布工序的投影电极的涂膜的厚度来减少投影电极的制造工序。 构成:在基板(1)上形成电极(12)。 在电极和绝缘层(11)上形成突起部(21)。 突出部分由具有导电性的金属构成。 通过在突出部的表面中使用取代的镀金液形成涂膜(22)。 突出部分电连接到电极。
公开/授权文献:
- KR101137757B1 돌기 전극의 형성 방법 및 치환 금 도금액 公开/授权日:2012-04-24
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
--------------H01L21/60 | ....引线或其他导电构件的连接,用于工作时向或由器件传导电流 |