基本信息:
- 专利标题： 열경화성 수지 조성물
- 专利标题（英）：Heat curable resin composition
- 专利标题（中）：热固性树脂组合物
- 申请号：KR1020107003433 申请日：2008-07-11
- 公开(公告)号：KR1020100040932A 公开(公告)日：2010-04-21
- 发明人： 우메자와도모까즈 , 와다데쯔오 , 이노우에히로후미
- 申请人： 쇼와 덴코 가부시키가이샤
- 申请人地址： **-*, Shibadaimon *-chome, Minato-ku, Tokyo ***-****, Japan
- 专利权人： 쇼와 덴코 가부시키가이샤
- 当前专利权人： 쇼와 덴코 가부시키가이샤
- 当前专利权人地址： **-*, Shibadaimon *-chome, Minato-ku, Tokyo ***-****, Japan
- 代理人： 장수길; 이중희
- 优先权： JPJP-P-2007-187123 2007-07-18
- 国际申请： PCT/JP2008/062572 2008-07-11
- 国际公布： WO2009011304 2009-01-22
- 主分类号： C08G59/42
- IPC分类号： C08G59/42 ; H01L21/60 ; H01L23/29 ; H05K3/28
摘要：
[MEANS FOR SOLVING PROBLEMS] A heat curable resin composition comprising (A) a resin containing two or more carboxyl groups and having a polyurethane structure, (B) a strongly basic nitrogen-containing heterocyclic compound having a pKa value of 10.0 to 14.0 as a curing accelerator, and (C) a curing agent. A cured product of the heat curable resin composition is used as an insulating protective film, for example, for printed wiring boards, flexible printed wiring boards, and chip-on films. The heat curable resin composition has improved low-temperature curability and instantaneous curability, can realize tack-free properties, can simultaneously realize low warpage properties and electric insulating properties, does not contaminate a curing oven and the like with an out gas during heating, has a satisfactory pot life, can form excellent cured products and insulating protective films, and can form solder resists and insulating protective films at low cost with good productivity. Further, this composition can be utilized to supply electronic components to which excellent properties have been imparted.
摘要（中）：
[解决问题的方法]一种热固性树脂组合物，其包含（A）含有两个以上羧基并具有聚氨酯结构的树脂，（B）pKa值为10.0〜14.0的强碱性含氮杂环化合物作为 固化促进剂，（C）固化剂。 作为绝热保护膜，可以使用热固性树脂组合物的固化物，例如印刷电路板，柔性印刷电路板，贴片膜等。 热固性树脂组合物具有改善的低温固化性和瞬时固化性，可以实现无粘性，同时实现低翘曲性和电绝缘性，在加热期间不会产生外部气体污染固化炉等，具有 令人满意的适用期，可以形成优良的固化产物和绝缘保护膜，并且可以以低成本形成阻焊剂和绝缘保护膜，生产率高。 此外，该组合物可以用于提供赋予了优异性能的电子部件。
公开/授权文献:
- KR101151196B1 열경화성 수지 조성물 公开/授权日：2012-06-08