基本信息:
- 专利标题： 접착제 조성물, 필름상 접착제, 접착시트, 및 그것을이용한 반도체장치
- 专利标题（英）：Adhesive composition, filmy adhesive, adhesive sheet, and semiconductor device made with the same
- 专利标题（中）：胶粘组合物，胶粘剂，粘合片及其半导体器件
- 申请号：KR1020087016538 申请日：2007-01-23
- 公开(公告)号：KR1020080075031A 公开(公告)日：2008-08-13
- 发明人： 마스코타카시 , 미야하라마사노부 , 오쿠보케이스케
- 申请人： 히타치가세이가부시끼가이샤
- 申请人地址： *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 专利权人： 히타치가세이가부시끼가이샤
- 当前专利权人： 히타치가세이가부시끼가이샤
- 当前专利权人地址： *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 代理人： 특허법인원전
- 优先权： JPJP-P-2006-00013854 2006-01-23; JPJP-P-2006-00197324 2006-07-19
- 国际申请： PCT/JP2007/050985 2007-01-23
- 国际公布： WO2007083810 2007-07-26
- 主分类号： C09J4/02
- IPC分类号： C09J4/02 ; C09J7/02
摘要：
An adhesive composition which can reconcile, to a high degree, process characteristics including suitability for filling on an adherend (suitability for infiltration) and suitability for low-temperature laminating with semiconductor device reliability such as reflow resistance; and a filmy adhesive, an adhesive sheet having excellent process characteristics including easy strippability from dicing sheets, and a semiconductor device having excellent productivity, high adhesion strength at high temperatures, and excellent moisture resistance which each comprises or is produced with the adhesive composition. The adhesive composition comprises (A) a thermoplastic resin, (B) a bisallylnadimide represented by the following general formula (I), and (C) a (meth)acrylate compound having a functionality of 2 or higher. (Chemical formula 1) (I) (In the formula, R1 is a divalent organic group comprising an aromatic ring and/or a linear, branched, or cyclic aliphatic hydrocarbon.)
摘要（中）：
粘合剂组合物能够高度适应包括适用于被粘物（适用于渗透）的工艺特性和适用于低温层压的半导体器件可靠性如耐回流性的工艺特性; 以及薄膜状粘合剂，具有优异的加工特性的粘合片，包括切割片的剥离性，以及具有优异的生产率，高温下的高粘合强度和优异的耐湿性的半导体器件，其各自包含或者用粘合剂组合物制造。 粘合剂组合物包含（A）热塑性树脂，（B）由以下通式（I）表示的双丙烯酰亚胺酰亚胺和（C）官能度为2或更高的（甲基）丙烯酸酯化合物。 （化学式1）（I）（式中，R 1为包含芳环和/或直链，支链或环状脂族烃的二价有机基团。
公开/授权文献:
- KR101014483B1 접착제 조성물, 필름상 접착제, 접착시트, 및 그것을이용한 반도체장치 公开/授权日：2011-02-14
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C09 | 染料；涂料；抛光剂；天然树脂；黏合剂；其他类目不包含的组合物；其他类目不包含的材料的应用 |
| ----C09J | 黏合剂；一般黏合方法（非机械部分）；其他类目不包括的黏合方法；黏合剂材料的应用 |
| ------C09J4/00 | 基于至少具有1个可聚合的碳—碳不饱和键的非高分子有机化合物的黏合剂 |
| --------C09J4/02 | .丙烯酰基单体 |