基本信息:
- 专利标题： 박리층용 페이스트의 제조방법 및 적층형 전자 부품의제조방법
- 专利标题（英）：Method for fabricating paste for exfoliation layer and method for fabricating stack type electronic components
- 专利标题（中）：用于制造用于浮选层的浆料的方法和用于制造堆叠型电子部件的方法
- 申请号：KR1020050076195 申请日：2005-08-19
- 公开(公告)号：KR1020060053167A 公开(公告)日：2006-05-19
- 发明人： 이시야마다모츠 , 사토시게키
- 申请人： 티디케이가부시기가이샤
- 申请人地址： *-*-*, Shibaura, Minato-ku, Tokyo, Japan
- 专利权人： 티디케이가부시기가이샤
- 当前专利权人： 티디케이가부시기가이샤
- 当前专利权人地址： *-*-*, Shibaura, Minato-ku, Tokyo, Japan
- 代理人： 한양특허법인
- 优先权： JPJP-P-2004-00240828 2004-08-20
- 主分类号： H01G4/30
- IPC分类号： H01G4/30 ; H01G4/12
6 ∼1.3×10
7 (1/s) 의 전단속도를 가하는 고압 분산 처리 공정을 가지는 박리층용 페이스트의 제조방법.
박리층, 페이스트
A step of a method for producing a release layer paste used for producing a multilayer type electronic device, the average particle diameter is not more than 0.1㎛ ceramic powder, a binder and a dispersing agent, the concentration of the non-volatile content greater than preparing a primary slurry 30% by weight and, the one added to the binder lacquer solutions in the primary slurry is diluted to the primary slurry, and less than 15% by weight concentration of the non-volatile content, also less than the content of the binder, 12 parts by weight based on the ceramic powder 100 parts by weight second, insert a step of preparing a slurry, the second slurry on a wet jet mill or the second slurry on 1.5 × 10 6 ~1.3 × 10 7 ( 1 / s) having a high-pressure dispersion treatment step of applying a shear rate of method of producing a release layer paste. Release layer paste
公开/授权文献:
- KR100720802B1 박리층용 페이스트의 제조방법 및 적층형 전자 부품의제조방법 公开/授权日：2007-05-21
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01G | 电容器；电解型的电容器、整流器、检波器、开关器件、光敏器件或热敏器件 |
| ------H01G4/00 | 固定电容器；及其制造方法 |
| --------H01G4/30 | .叠层电容器 |