基本信息:
- 专利标题： 표면글라스 용출법에 의한 알루미나 소성기판의 고온접합방법
- 专利标题（英）：High temperature bonding technology of sintered alumina substrate by surface glass extraction method
- 专利标题（中）：通过玻璃表面提取的烧结铝基材的高温结合方法
- 申请号：KR1020030000181 申请日：2002-12-30
- 公开(公告)号：KR1020040060683A 公开(公告)日：2004-07-06
- 发明人： 김동식 , 박금석
- 申请人： (주)에이지광학
- 申请人地址： **, Hanamsandan *beon-ro, Gwangsan-gu, Gwangju, korea
- 专利权人： (주)에이지광학
- 当前专利权人： (주)에이지광학
- 当前专利权人地址： **, Hanamsandan *beon-ro, Gwangsan-gu, Gwangju, korea
- 主分类号： C04B37/00
- IPC分类号： C04B37/00
摘要：
PURPOSE: A high temperature bonding method of a sintered alumina substrate by adopting a glass surface extraction method is provided to prevent or reduce the conventional problems including decrease in strength, fume generation, occurrence of particles and a defective wafer caused by static electricity and magnetism, in a ceramic arm of a handler used in a semiconductor production. CONSTITUTION: A high temperature bonding method of three of sintered alumina substrates comprises the step of extracting the glass present in the surface of a sintered alumina substrate which comprises 94-96% of Al2O3 and 2-3% of SiO2, and has a thickness of 0.5-1.0 mm, at 1400-1700 deg.C with applying a certain load.
摘要（中）：
目的：提供采用玻璃表面提取方法的氧化铝烧结烧结体的高温接合方法，以防止或降低由静电和磁性引起的强度，烟雾产生，颗粒的发生和缺陷晶片的常规问题， 在用于半导体生产的处理器的陶瓷臂中。 构成：三个烧结氧化铝衬底的高温接合方法包括提取包含94-96％的Al 2 O 3和2-3％的SiO 2的烧结氧化铝衬底的表面中存在的玻璃的步骤，并且具有 0.5-1.0毫米，1400-1700摄氏度，施加一定的载荷。