基本信息:
- 专利标题： 수지밀봉형 반도체장치의 제조방법
- 专利标题（英）：Resin-encapsulated semiconductor device and method for manufacturing the same
- 专利标题（中）：树脂封装的半导体器件及其制造方法
- 申请号：KR1019997005557 申请日：1996-12-26
- 公开(公告)号：KR1020000057697A 公开(公告)日：2000-09-25
- 发明人： 미야키요시노리 , 스즈키히로미치 , 스즈키가즈나리 , 니시타타카후미 , 이토후지오 , 쯔보사키쿠니히로 , 카메오카아키히코 , 니시쿠니히코
- 申请人： 가부시키가이샤 히타치세이사쿠쇼 , 가부시키가이샤 히타치초에루. 에스. 아이. 시스테무즈
- 申请人地址： *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, Japan
- 专利权人： 가부시키가이샤 히타치세이사쿠쇼,가부시키가이샤 히타치초에루. 에스. 아이. 시스테무즈
- 当前专利权人： 가부시키가이샤 히타치세이사쿠쇼,가부시키가이샤 히타치초에루. 에스. 아이. 시스테무즈
- 当前专利权人地址： *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, Japan
- 代理人： 특허법인원전
- 国际申请： PCT/JP1996/003808 1996-12-26
- 国际公布： WO1998029903 1998-07-09
- 主分类号： H01L21/56
- IPC分类号： H01L21/56
摘要：
PURPOSE: A yield of the resin-encapsulated semiconductor device is provided for the semiconductor chip, bonding wires, etc., are exposed from the molded resin body. CONSTITUTION: A method for manufacturing a resin-encapsulated semiconductor device in which a die pad has an area smaller than that of a semiconductor chip mounted on the major surface of the die pad and the semiconductor chip and the die pad are encapsulated in a molded resin body. The semiconductor chip and the die pad are so arranged in the cavity of a mold that the clearance between the rear surface of the die pad and the opposed internal surface of the cavity is narrower than the clearance between the major surface of the semiconductor chip and the opposed internal surface of the cavity by the distance corresponding to the thickness of the die pad. A resin body is molded by simultaneously injecting the resin into the cavity through center gates. Thus the semiconductor chip is not moved upward by the resin injected into the space on the rear side of the chip.
摘要（中）：
目的：提供半导体芯片，接合线等从模制树脂体露出树脂封装的半导体器件的产率。 构成：一种制造树脂封装的半导体器件的方法，其中管芯焊盘的面积小于安装在管芯焊盘的主表面上的半导体芯片的面积，并且半导体芯片和管芯焊盘被封装在模制树脂中 身体。 半导体芯片和芯片焊盘被布置在模具的空腔中，芯片垫的后表面和腔的相对的内表面之间的间隙比半导体芯片的主表面和 相对于腔体的内表面相应于芯片焊盘厚度的距离。 通过同时将树脂注入到通过中心门的空腔中模制树脂体。 因此，通过注入到芯片背面的空间中的树脂，半导体芯片不会向上移动。
公开/授权文献:
- KR100462105B1 수지밀봉형 반도체장치의 제조방법 公开/授权日：2004-12-17
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/56 | ....封装，例如密封层、涂层 |