基本信息:
- 专利标题： 반도체 패키지
- 专利标题（英）：KR101916088B1 - Semiconductor Package
- 申请号：KR1020120034044 申请日：2012-04-02
- 公开(公告)号：KR101916088B1 公开(公告)日：2018-11-07
- 发明人： 김영룡 , 장재권
- 申请人： 삼성전자주식회사
- 申请人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 专利权人： 삼성전자주식회사
- 当前专利权人： 삼성전자주식회사
- 当前专利权人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 代理人： 특허법인 고려
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
It provides a semiconductor package. A semiconductor package, a circuit board comprising a substrate pad and facing the circuit board and spaced apart, and includes a connection pattern for electrically connecting the semiconductor chip and the circuit board and a semiconductor chip that includes a chip pad. The semiconductor chip includes a first vias in the semiconductor chip, electrically connected to a plurality of first circuit patterns and the chip pad and the first circuit pattern is vertically arranged with respect to the upper surface of the semiconductor chip. Chip pad, comprising: a second region of the outer shell of the first area and the first area in which the connection contact pattern, the first via is connected to the second area.
公开/授权文献:
- KR1020130111841A 반도체 패키지 公开/授权日：2013-10-11
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |