基本信息:
- 专利标题： 본딩용 와이어
- 专利标题（英）：KR101905942B1 - Bonding wire
- 申请号：KR1020157014935 申请日：2013-11-06
- 公开(公告)号：KR101905942B1 公开(公告)日：2018-10-08
- 发明人： 하세가와츠요시 , 구로사키유지
- 申请人： 타츠타 전선 주식회사
- 申请人地址： 일본 오사카후 히가시오사카시 이와타쵸 *쵸메 *반 *고
- 专利权人： 타츠타 전선 주식회사
- 当前专利权人： 타츠타 전선 주식회사
- 当前专利权人地址： 일본 오사카후 히가시오사카시 이와타쵸 *쵸메 *반 *고
- 代理人： 특허법인태평양
- 优先权： JPJP-P-2012-245424 2012-11-07
- 国际申请： PCT/JP2013/079980 2013-11-06
- 国际公布： WO2014073555 2014-05-15
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; C22C5/06 ; C22F1/00 ; C22F1/14
Ni / Pd / Au coated electrode (a) or Au coated electrode (a) good bonding properties with, the thermal shock resistance is excellent, and a bonding wire for an inexpensive than gold bonding wires. A bonding wire (W) for for connecting in accordance with the ball bonding method, Pd, not less than 1.0% by weight of at least one element selected from Au in a total amount, 4.0% by weight, selected from Ca, Y, La, Sm, Ce a least one element in a total amount comprising 20 ppm by weight or more, less than 500 ppm by weight, the balance being made of Ag and inevitable impurities, tensile strength in a tensile strength at room temperature for
18 ~ 32kgf / mm 2, 250 ℃ It is not less than 14kgf / mm
2. If this configuration, in each of the evaluation of the continuous bonding property, the heat cycle test, the evaluation, within hwanghwaseong (sulfidation resistance) of the wires of the wire flow (wire flow) at the time of evaluation, the electric resistance, the resin encapsulation of chip damage to the 1st junction directly under , there is no practical problem.
公开/授权文献:
- KR1020150082518A 본딩용 와이어 公开/授权日：2015-07-15
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |