基本信息:
- 专利标题： 네 개의 채널들을 가진 반도체 패키지
- 专利标题（英）：KR101901324B1 - Semiconductor Packages Having 4-Channels
- 申请号：KR1020110109548 申请日：2011-10-25
- 公开(公告)号：KR101901324B1 公开(公告)日：2018-09-27
- 发明人： 권흥규 , 김영배 , 이윤희
- 申请人： 삼성전자주식회사
- 申请人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 专利权人： 삼성전자주식회사
- 当前专利权人： 삼성전자주식회사
- 当前专利权人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 代理人： 리앤목특허법인
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L23/52 ; H01L23/12
A semiconductor package having four channels is proposed. The first to fourth is mounted on an upper package substrate, and the upper package and the lower package substrate, and the bottom package substrate including the first to fourth upper semiconductor element mounted on the top package substrate having a top edge, respectively, the first to the fourth of the first to the lower semiconductor element having four naebyeon, and each of the said first to the arrangement as close as the 4 naebyeon to the first to fourth sub-chip connection elements corresponding to the upper edge a lower package having, the first to fourth sub-chip connection elements, the first to fourth may be electrically connected to the lower semiconductor element and the upper semiconductor element independently of the respective.
公开/授权文献:
- KR1020130045090A 네 개의 채널들을 가진 반도체 패키지 公开/授权日：2013-05-03
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/50 | ..用于集成电路器件的 |