基本信息:
- 专利标题： 무전해 니켈 또는 니켈 합금 도금용 니켈 콜로이드 촉매액 및 무전해 니켈 또는 니켈 합금 도금방법
- 专利标题（英）：KR101831099B1 - Nickel colloid catalyst solution for electroless nickel or nickel alloy plating, and electroless nickel or nickel alloy plating method
- 专利标题（中）：无电镀镍或镍合金镀镍胶体催化剂液和无电镍或镍合金电镀工艺
- 申请号：KR1020167035470 申请日：2015-07-17
- 公开(公告)号：KR101831099B1 公开(公告)日：2018-04-04
- 发明人： 우치다에이 , 다나카가오루 , 가와바타아이
- 申请人： 이시하라 케미칼 가부시키가이샤
- 申请人地址： *-** Nishiyanagiwara-cho, Hyogo-ku, Kobe-shi, Hyogo ***-****, Japan
- 专利权人： 이시하라 케미칼 가부시키가이샤
- 当前专利权人： 이시하라 케미칼 가부시키가이샤
- 当前专利权人地址： *-** Nishiyanagiwara-cho, Hyogo-ku, Kobe-shi, Hyogo ***-****, Japan
- 代理人： 제일특허법인
- 优先权： JPJP-P-2014-184889 2014-09-11
- 国际申请： PCT/JP2015/070619 2015-07-17
- 国际公布： WO2016039016 2016-03-17
- 主分类号： C23C18/34
- IPC分类号： C23C18/34 ; C23C18/36 ; C23C18/50 ; C23C18/16
After being subjected to surfactant-containing liquid pre-adsorption promoting treatment by immersing the non-conductive substrate to, (A) a water-soluble copper salt and (B) a reducing agent and (C) as an electroless nickel electroplating nickel colloidal catalyst liquid containing a colloidal stabilizer, the non- a catalyst on a conductive substrate, followed by electroless nickel plating is performed. After enhancing the catalyst activity by promoting absorption pre-treatment, since the coating to give a catalyst with excellent stability with time, and the electroless catalyst solution, it is possible to obtain a uniform coating film with no uneven nickel precipitation. The nickel plating method, it is possible to obtain a nickel alloy having excellent film uniformity by applying the nickel alloy plating process.
公开/授权文献:
- KR1020170008287A 무전해 니켈 또는 니켈 합금 도금용 니켈 콜로이드 촉매액 및 무전해 니켈 또는 니켈 합금 도금방법 公开/授权日：2017-01-23