The invention method of bonding a sintered copper alloy powder containing lead on steel and on the sintered joined body.
According to the sintered bonding a copper alloy containing lead on steel, steel and copper alloy material bonding interface to thus is lead precipitates formed has a surface area of ​​steel and a copper alloy to prevent the bonding strength reduction material sintering joining method and a sintering It provides a bonded body.
Forming a first copper alloy powder layer on a steel product;
Forming a first copper alloy layer bonded to the first bonding a sintered copper alloy layer to the steel powder;
Forming a second copper alloy powder layer on the first copper alloy bonding layer;
The second by sintering and diffusion bonding a copper alloy powder layer subjected to a sintered bond of the second stage goes through the step of forming a second copper alloy bonding layer,
It said first layer of copper alloy powder does not contain lead powder as an ingredient,
The second copper alloy powder layer includes a powder of lead as a component,
The cupric to the process of forming an alloy bonding layer with the lead component included in the second copper-alloy powder layer of the first to the copper alloy bonding layer diffuse into the dispersion to precipitate said first copper alloy bonding layer with the first 2 copper alloy bonding layer is characterized by forming the copper alloy of the bonding layer at all.
By separating the copper alloy powder does not contain a copper alloy powder and lead containing lead as described above to step sintering and diffusion bonding, the lead precipitates along a sinter bonded interface of the steel and the copper alloy which has a surface area formed a problem with conventional techniques is avoided, as a result, the bond strength between the steel and the copper alloy material is greatly improved.