基本信息:
- 专利标题： 삼차원 회로 구조체의 제조 방법, 그 방법에 의해 제조된 삼차원 회로 구조체 및 삼차원 회로 구조체를 제조하는 장치
- 专利标题（英）：Method and apparatus for manufacturing 3d circuit structure, 3d circuit structure thereof
- 申请号：KR1020150044195 申请日：2015-03-30
- 公开(公告)号：KR101700669B1 公开(公告)日：2017-01-31
- 发明人： 정구봉 , 심용식
- 申请人： 주식회사 지앤아이솔루션
- 申请人地址： ***, **, Digital-ro *-gil, Geumcheon-gu, Seoul, Korea
- 专利权人： 주식회사 지앤아이솔루션
- 当前专利权人： 주식회사 지앤아이솔루션
- 当前专利权人地址： ***, **, Digital-ro *-gil, Geumcheon-gu, Seoul, Korea
- 代理人： 이대호; 박건홍
- 主分类号： B29C67/00
- IPC分类号： B29C67/00 ; B33Y30/00 ; B33Y50/02 ; H05K1/02
The present invention relates to a method of manufacturing a three-dimensional circuit structure, one embodiment according to the present invention is a method of manufacturing a three-dimensional circuit structure, comprising the steps of: providing a first three-dimensional circuit structure for producing a sheet (step A), the first three-dimensional the circuit further comprising: printing a circuit of a conductive material on a predetermined circuit on the upper surface of the structure for producing the sheet (step B), the method comprising: providing a two-dimensional circuit structure for producing a sheet (step C), for producing the second three-dimensional circuit structure sheet a step of forming a through-hole (step D), attaching a second three-dimensional circuit structure for producing a sheet is a through-hole formed in the upper surface of the first three-dimensional circuit structure for producing a sheet (step E), the conductivity in the through-hole the step of printing the circuit of a material (step F) and the second three-dimensional circuit on an upper surface of said predetermined structure-producing sheet It can also be the basis of providing a method of manufacturing a three-dimensional circuit structure, comprising the step (step G) for printing the conductive material.