基本信息:
- 专利标题： 핀 일체형 기판 및 핀 일체형 기판의 제조 방법
- 专利标题（英）：Substrate with integrated fins and method of manufacturing substrate with integrated fins
- 专利标题（中）：基础组织结构自动化
- 申请号：KR1020127018072 申请日：2011-01-12
- 公开(公告)号：KR101690825B1 公开(公告)日：2017-01-09
- 发明人： 호리히사시 , 오사나이히데요 , 다까하시다까유끼
- 申请人： 니폰게이긴조쿠가부시키가이샤 , 도와 메탈테크 가부시키가이샤
- 申请人地址： 일본국 도쿄 시나가와구 히가시시나가와 *-초메 *-**
- 专利权人： 니폰게이긴조쿠가부시키가이샤,도와 메탈테크 가부시키가이샤
- 当前专利权人： 니폰게이긴조쿠가부시키가이샤,도와 메탈테크 가부시키가이샤
- 当前专利权人地址： 일본국 도쿄 시나가와구 히가시시나가와 *-초메 *-**
- 代理人： 장수길; 성재동
- 优先权： JPJP-P-2010-003630 2010-01-12; JPJP-P-2011-000386 2011-01-05
- 国际申请： PCT/JP2011/050381 2011-01-12
- 国际公布： WO2011087028 2011-07-21
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L23/473 ; H01L21/48
The present invention is bonded with the ceramic substrate 10 of the pin and the method for manufacturing a one-piece substrate, a metal circuit board (15) for suppressing (generation of inversely related) variations in the bending or heat radiating fins of the metal base plate is performed by the molten metal bonding method, forming a plurality of heat radiating fins (20a) is part of the blood cut portion of the metal base plate 20 is subjected to fixing by a jig so as to load the tensile stress in the surface which forms the radiation fin (20a), cutting of said blood, tensile a method for manufacturing a one-piece pin which is formed by the substrate is moved while rotating the multi-layered disc-shaped cutter having a plurality of cutters on a stress load side line grooves bet process to form a plurality of grooves (25).
公开/授权文献:
- KR1020130000372A 핀 일체형 기판 및 핀 일체형 기판의 제조 방법 公开/授权日：2013-01-02
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/36 | ..为便于冷却或加热对材料或造型的选择，例如散热器 |
| ------------H01L23/373 | ...为便于冷却的器件材料选择 |