The present invention at least one electrically-conductive layer and at least one electrical-insulating layer in the flex circuit is configured; Optical port defining a barrel cavity; And barrel activity is located within the cavity and electrically coupled to the flex circuit and an optical component subassemblies; And it said optical port is optically coupled from the flex coupling part to the flex circuit and a mechanical sub-assembly as an optical sub-assembly comprising a
To create a flexible circuit array (array) of epoxy to the top cover, the upper metal core, a bottom metal, and a lower cover (epoxying) step; Attaching the other of the plurality of the heat sink stiffener each flex circuit in the array of flex circuit; In the array of flex circuit comprising: electrically coupling the other of the plurality of active optical components, subassemblies each flex circuit; And a plurality of active optical components, sub-assemblies, each step in which the remainder is the installation of a plurality of engineering port to each flex circuit in an array of Prex circuit so as to be located within the barrel cavity defined by one of a plurality of optical ports; Flex containing It relates to a method of assembling a chip of the array on the optical subassembly.