基本信息:
- 专利标题： 유체 공급 장치 및 이를 포함하는 기판 처리 시스템
- 专利标题（英）：Apparutus for supplying fluid and substrate process system having the same
- 专利标题（中）：用于提供流体的Apparutus和具有该流体的底物处理系统
- 申请号：KR1020140182900 申请日：2014-12-18
- 公开(公告)号：KR101659317B1 公开(公告)日：2016-09-23
- 发明人： 김동헌
- 申请人： 멜콘 주식회사 , 김동헌
- 申请人地址： 경기도 화성시 동탄면 동탄산단*길 *-**
- 专利权人： 멜콘 주식회사,김동헌
- 当前专利权人： 멜콘 주식회사,김동헌
- 当前专利权人地址： 경기도 화성시 동탄면 동탄산단*길 *-**
- 代理人： 특허법인엠에이피에스
- 主分类号： H01L21/027
- IPC分类号： H01L21/027 ; H01L21/02
And a fluid supply device for supplying a fluid disclosed in the substrate processing apparatus, the fluid supply device is an external gas inlet, a temperature adjusting unit for adjusting the temperature of the gas, with a humidifying tank to control the humidity of the exchanger gas humidity control unit; And comprising a liquid supply unit for controlling the supply to the temperature of the gas supply unit and a liquid including a blower for supplying a class wherein the temperature and humidity controlled gas received from the humidity control unit in the substrate processing apparatus, the humidifying tank the supplied liquid is accommodated, the humidification heating unit for heating the liquid; And it located in the upper portion of the humidification heating, and a cover that is one or more humidification Humidification hole is formed in the upper surface.
公开/授权文献:
- KR1020160074090A 유체 공급 장치 및 이를 포함하는 기판 처리 시스템 公开/授权日：2016-06-28
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |