基本信息:
- 专利标题： 센서 패키지 및 그 제조 방법
- 专利标题（英）：Sensor package and a method of manufacturing
- 专利标题（中）：传感器封装及其制造方法
- 申请号：KR1020140172090 申请日：2014-12-03
- 公开(公告)号：KR101654433B1 公开(公告)日：2016-09-05
- 发明人： 백종식 , 박노선
- 申请人： 앰코 테크놀로지 코리아 주식회사
- 申请人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 代理人： 서만규; 서경민
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
One embodiment of the invention relates to a sensor package and a method of manufacturing the same, to solve the technical problem that is lowering the thickness and manufacturing cost.
To this end, the present invention includes the steps of preparing a first semiconductor die is a first bond pad is formed; The step of bonding the first semiconductor die to the second semiconductor die bond pads 2 are formed; Comprising first and second to form a first passivation layer on the semiconductor die, the first and second bond pads are exposed to the outside; The step of mutually connecting the second bond pad to the re-distribution layer; And discloses a method for manufacturing a sensor package and the package according to this sensor consisting of a phase for connecting the conductive bumps on the re-distribution layer.
公开/授权文献:
- KR1020160066832A 센서 패키지 및 그 제조 방법 公开/授权日：2016-06-13
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/48 | .用于向或自处于工作中的固态物体通电的装置，例如引线、接线端装置 |