基本信息:
- 专利标题: 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
- 专利标题(英):Composition for forming conductive pattern and resin structure having conductive pattern thereon
- 专利标题(中):形成导电图案的组合物和具有导电图案的树脂结构
- 申请号:KR1020140163271 申请日:2014-11-21
- 公开(公告)号:KR101633846B1 公开(公告)日:2016-06-27
- 发明人: 전신희 , 박치성 , 김재현 , 정상윤 , 박철희 , 정한나
- 申请人: 주식회사 엘지화학
- 申请人地址: ***, Yeoui-daero, Yeongdeungpo-gu, Seoul, Republic of Korea
- 专利权人: 주식회사 엘지화학
- 当前专利权人: 주식회사 엘지화학
- 当前专利权人地址: ***, Yeoui-daero, Yeongdeungpo-gu, Seoul, Republic of Korea
- 代理人: 유미특허법인
- 优先权: KR1020130143811 2013-11-25
- 主分类号: H01B1/22
- IPC分类号: H01B1/22 ; H01B13/00 ; H01B5/14
The present invention on various polymer resin products or resin layer, while able to form a fine conductive pattern in a simplified process, obtained with electrically conductive patterns forming composition capable of imparting excellent flame retardancy to the resin product or resin layer and this It relates to a resin structure having a conductive pattern. The conductive pattern forming composition is a polymer resin; First metal and the second metal includes Or non-conductive metal compounds having the P6
3 / mmc space group structure; And by including a flame retardant, and an electromagnetic wave irradiation, from the non-conductive metal compounds, a metal core comprising the first and second metals or their ions that may be formed.
公开/授权文献:
- KR1020150060555A 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체 公开/授权日:2015-06-03
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01B | 电缆;导体;绝缘体;导电、绝缘或介电材料的选择 |
------H01B1/00 | 按导电材料特性区分的导体或导电物体;用作导体的材料选择 |
--------H01B1/06 | .主要由其他非金属物质组成的 |
----------H01B1/22 | ..包含金属或合金的导电材料 |