基本信息:
- 专利标题： 플립 칩 본더 및 본딩 스테이지의 평탄도 및 변형량 보정 방법
- 专利标题（英）：FIG deformation correcting method and flatness of the flip chip bonder and bonding stage
- 专利标题（中）：翻转粘合剂和校正平坦度和粘结层的变形量的方法
- 申请号：KR1020147029965 申请日：2013-12-19
- 公开(公告)号：KR101603536B1 公开(公告)日：2016-03-15
- 发明人： 세야마코헤이
- 申请人： 가부시키가이샤 신가와
- 申请人地址： *-**-*, Inadaira, Musashimurayama-shi, Tokyo, Japan
- 专利权人： 가부시키가이샤 신가와
- 当前专利权人： 가부시키가이샤 신가와
- 当前专利权人地址： *-**-*, Inadaira, Musashimurayama-shi, Tokyo, Japan
- 代理人： 송봉식; 정삼영
- 优先权： JPJP-P-2012-278884 2012-12-21
- 国际申请： PCT/JP2013/084042 2013-12-19
- 国际公布： WO2014098174 2014-06-26
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/683 ; H01L21/02
The base 12 and the bonding stage 20, supporting a plurality of support points installed in and attached to the base 12, the lower face of the bonding stage 20, 22 in the respective up and down directions with the addition, vertical positions of the support points a plurality of vertical position adjustment to adjust the support mechanism 30, and the base 12, the bonding stage and a plate spring mechanism (40) for connecting (20), a plate spring mechanism 40 is the bonding stage (20 ) of the bonding stage to the surface (21) X-axis direction and a base 12. the base 12 and constrain the relative movement of the bonding stage 20, for about the Y-axis direction orthogonal to the X-axis in accordance with the and the first twist around the X axis of 20, and the second twist around the Y-axis, allowing for movement in the vertical direction of the bonding stage 20 on the base 12. As a result, we plan to enhance and speed up the bonding quality in the flip chip bonder.
公开/授权文献:
- KR1020140139079A 플립 칩 본더 및 본딩 스테이지의 평탄도 및 변형량 보정 방법 公开/授权日：2014-12-04
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |