基本信息:
- 专利标题： 와이어 본딩 장치
- 专利标题（英）：Wire bonding device
- 专利标题（中）：电线连接装置
- 申请号：KR1020147002374 申请日：2012-05-30
- 公开(公告)号：KR101587569B1 公开(公告)日：2016-01-21
- 发明人： 쿠니요시카츠토시 , 키우치하야토
- 申请人： 가부시키가이샤 신가와
- 申请人地址： *-**-*, Inadaira, Musashimurayama-shi, Tokyo, Japan
- 专利权人： 가부시키가이샤 신가와
- 当前专利权人： 가부시키가이샤 신가와
- 当前专利权人地址： *-**-*, Inadaira, Musashimurayama-shi, Tokyo, Japan
- 代理人： 송봉식; 정삼영
- 优先权： JPJP-P-2011-178019 2011-08-16; JPJP-P-2011-278335 2011-12-20
- 国际申请： PCT/JP2012/063844 2012-05-30
- 国际公布： WO2013024612 2013-02-21
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
An upper surface (21a) of the capillary for bonding the wire to each electrode 31 and the capillary the tip fell in 31 kkothineun through hole (22) is installed, the horizontal plate 21, horizontal plate 21, the center of the through-holes 22 along the upper surface (21a) of the through hole and the center (22c) the oxidation-preventing gas passage (12) 1 spouting gas preventing oxidation toward the 22, horizontal plate 21, along the ( 22c) a toward the prevention each oxide of the first oxidation-preventing gas passage (12) and cross the second oxidation-preventing gas flow path 13, and the horizontal plate 21 provided with a spouting preventing oxidizing gas from the direction of the gas flow path (12) , it is open so that the leak to the outside of the edge 23 to 25 of the 13 that are regions not arranged, can be flat upper surface (21a) may have a base plate 21 of the (21). As a result, it suppresses the oxidation of the free air ball surface in the wire bonding device.
公开/授权文献:
- KR1020140040842A 와이어 본딩 장치 公开/授权日：2014-04-03
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |