基本信息:
- 专利标题： 다층배선기판
- 专利标题（英）：Multilayer wiring substrate
- 专利标题（中）：多层布线基板
- 申请号：KR1020147011034 申请日：2013-03-20
- 公开(公告)号：KR101579019B1 公开(公告)日：2015-12-18
- 发明人： 마에다신노스케
- 申请人： 니혼도꾸슈도교 가부시키가이샤
- 申请人地址： 일본국 아이치켄 나고야시 미주호쿠 다카츠지-초**-**
- 专利权人： 니혼도꾸슈도교 가부시키가이샤
- 当前专利权人： 니혼도꾸슈도교 가부시키가이샤
- 当前专利权人地址： 일본국 아이치켄 나고야시 미주호쿠 다카츠지-초**-**
- 代理人： 김병진; 노태정
- 优先权： JPJP-P-2012-101907 2012-04-26
- 国际申请： PCT/JP2013/001885 2013-03-20
- 国际公布： WO2013161181 2013-10-31
- 主分类号： H05K3/46
- IPC分类号： H05K3/46
To provide a multilayer wiring substrate which can sufficiently secure a bonding strength of the conformable conductor and the resin insulating layer.
The multilayer wiring board 10 has a multilayer structure by laminating a plurality of resin insulation layers (33-38) and a plurality of conductive layers (42) alternately. In the plurality of via holes 53 formed in the resin insulating layers 33 and 34 are formed respectively, the conformal via conductor 54 for electrically connecting between the conductor layer 42. The anchor portion 58 is formed by filling as a part of the resin insulating layers 35 and 36 laminated on the upper layer side to the inner side of the conformal via conductor 54. The lower side than the upper side of the anchor portion 58 is bulged to the outside in the radial direction of the via hole 53.
公开/授权文献:
- KR1020140065474A 다층배선기판 公开/授权日：2014-05-29
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/46 | .多层电路的制造 |