The invention etching the copper powder surfaces by relates to the application of the production and the dipole tag antenna copper paste corrosion protection in a single step, an inert gas atmosphere of hydrochloric acid, and copper in the copper powder the surface of the etch by the addition of aqueous phosphoric acid solution after the formation of phosphate, vinyl imidazole-silane, and by introducing the copolymer and the polystyrene sulfonate to form a corrosion resistant coating on the copper powder surfaces formed with the copper phosphate, excellent dispersibility of the centrifuge with an agate mortar a high viscosity by using Crawl provides a method for producing a copper paste, by using the screen printing presents a copper thin film on the flexible film paste gateum the dipole tag antenna characteristics during manufacture of high efficiency.
According to the present invention, the easy access to heat curing step without the heat resistance and electrical conductivity of copper paste excellent corrosion protection through a series of processes in a single process under the copper powder has an advantage that can be produced. Further, it provided by the thin-film copper paste which may be made in the present invention are not only not be tied to size and shape, take advantage of the relatively high price competitiveness of copper powder, in the mass production at a low cost advantages. Look in electrical applications side, was the prepared copper paste thin film has a uniform electric conductivity characteristics, it is possible to maintain the folding city, its flexibility characteristics due to the external force is available copper paste prepared with a high efficiency dipole tag antenna characteristics.