基本信息:
- 专利标题： 인쇄회로기판 및 그 제조방법
- 专利标题（英）：Printed circuit board and method of manufacturing the same
- 申请号：KR1020130136274 申请日：2013-11-11
- 公开(公告)号：KR101548816B1 公开(公告)日：2015-08-31
- 发明人： 조석현 , 남효승 , 이용삼 , 안석환
- 申请人： 삼성전기주식회사
- 申请人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 专利权人： 삼성전기주식회사
- 当前专利权人： 삼성전기주식회사
- 当前专利权人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 代理人： 특허법인씨엔에스
- 主分类号： H05K3/46
- IPC分类号： H05K3/46
摘要：
본발명은인쇄회로기판및 그제조방법에관한것이다.본발명의인쇄회로기판은, 글라스재질의코어; 상기코어의측면을비롯한외주면전체를감싸는절연재; 상기절연재상에형성된내부회로층; 및상기코어와절연재를관통하여상기내부회로층을연결하는비아;를포함한다.
摘要（英）：
The present invention relates to a printed circuit board and its manufacturing method.
A printed circuit board of the present invention, the core glass material; Insulation material surrounding the entire outer peripheral surface including the side of the core; An internal circuit formed on the insulating material layer; And through said core and insulating material, the via connecting the inner circuit layer, and a.
公开/授权文献:
- KR1020150054171A 인쇄회로기판 및 그 제조방법 公开/授权日：2015-05-20
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/46 | .多层电路的制造 |