The invention encapsulation module (A) prepared and / or micro relates to a method of encapsulating a mechanical structure, the through contact (2), structuring the electronic connecting means, such as wires, contacts and / or electronic structure, at least one step and the in / or etching process especially in the doped silicon in electric conductivity is formed from the blank of the semiconductor material, formed of an electronic connection means through the process, the base 6 of the semiconductor material to be electron connection means are arranged and causing, electronic connection means is an electrical contact to at least one of then embedding material 9 is filled with a filling material and / or the semiconductor base 6 has an outer surface (7,8) of the electronic connecting means is encapsulated modules (a) a prescribed number of a method which is removed after the embedding, at least one of structured and / or a bank of at least one of the isolated material which is configured, each process through contact (2) during the formation of the electronic connecting means according to the etching process a semiconductor material so having formed in the base (6), which form a semiconductor electrode (3). The invention also relates to the use of the at least one through contact (2) and at least one semiconductor electrode 3 and the encapsulation module and / or a micro-mechanical structure, and these vehicles.