The present invention relates to a second thin film copper foil manufacturing method, second thin-film copper foil manufacturing method according to the present invention, in the copper foil production method for producing an ultra-thin-film copper foil of less than 5μm thick, a copper material on the surface of the flexible insulating film, step by performing a sputtering process to form a base film having a conductive layer on the surface of; Forming a carrier film by performing sputtering process having a release layer having a uniform surface to the chromium of the material - on the surface of the base film of nickel; And copper sulfate to the carrier film, sulfuric acid, and a head in the diagram amount containing the brightening agent and then was passed through a roll-to-roll process method having a constant speed electroplating process of gradually adjusting the current density of the voltage applied to the carrier film performed to form a copper plating layer on the release layer of the carrier film; may include.
Accordingly, the present invention is, on the insulating film of soft copper, and nickel-chrome alloy sputtering process was performed to form a carrier film equipped with a conducting layer and the release layer and then electric copper plating process of a roll-to-roll method on the carrier film by performing only can form a copper thin film with a thickness corresponding to the second thin-film copper foil as a peeled off easily has the effect of providing a second thin film copper foil manufacturing method that can improve the productivity and mass productivity.