基本信息:
- 专利标题： 배선기판, 다수개 취득 배선기판, 및 그 제조방법
- 专利标题（英）：Wiring substrate, multi-piece wiring substrate, and method for manufacturing same
- 专利标题（中）：配线基板，多层接线基板及其制造方法
- 申请号：KR1020137030740 申请日：2012-02-01
- 公开(公告)号：KR101505355B1 公开(公告)日：2015-03-23
- 发明人： 하세가와마사미 , 히라야마사토시 , 기토나오키
- 申请人： 니혼도꾸슈도교 가부시키가이샤
- 申请人地址： 일본국 아이치켄 나고야시 미주호쿠 다카츠지-초**-**
- 专利权人： 니혼도꾸슈도교 가부시키가이샤
- 当前专利权人： 니혼도꾸슈도교 가부시키가이샤
- 当前专利权人地址： 일본국 아이치켄 나고야시 미주호쿠 다카츠지-초**-**
- 代理人： 김병진; 노태정
- 优先权： JPJP-P-2011-096829 2011-04-25
- 国际申请： PCT/JP2012/000671 2012-02-01
- 国际公布： WO2012147243 2012-11-01
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K3/00 ; H01L23/12
Multiple-piece circuit board to a plurality of service at the same time a plated film or a wiring board soldering material that is not damaged, the printed board covering the surface of the metallizing layer provided along each lateral side of the surface of the substrate main body, and that It provides a method of manufacturing. Made of a ceramic (S), the surface plane when the rectangle (3) and the back (4) and, positioned between the surface (3) and the back (4), and grooves positioned at the surface 3 side if the surface (7) and formed in the substrate body (2) with a four sides of the side (5) consisting of a cutting plane (6) which is located in (4) side, the front face 3 of the substrate main body 2 4 along the side of the side (5) is formed of, as a plane at the circuit board (1a) comprising a rectangular frame-shaped metallizations (11), grooves in each side surface (5) of the circuit board main body (2) forming surface 7, and between the metallization layers 11, the substrate main body (2) of the ceramic (S) located in a horizontal plane (13) formed is exposed, the wiring board (1a).
公开/授权文献:
- KR1020140004223A 배선기판, 다수개 취득 배선기판, 및 그 제조방법 公开/授权日：2014-01-10
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |