The present invention at least one fixed frame formed by the upper and lower through-holes and printed circuit board stiffeners to be seated; At least one seating projection inserted into the through-holes from the lower side of the fixed frame of the fixed frame and the first through-holes formed for penetrating up and down; The fixing protrusion is coupled the seating, seat frame which is communicated to the second through the first through hole of the seating protrusion hole formed up and down; And each ball through the first through hole and the second through-formed in the seating frame and seated in the seating frame lower protrusions, the fixing pin for fixing the reinforcing material and the printed circuit board; A base frame positioned in the seating frame, which is fixedly coupled the lower fixing pin; A first elastic member that is located between the fixed frame and the seating frame are selectively spaced to the seating frame and the fixed frame; And further comprising a second elastic member that is located between the seat frame and the base frame selectively spaced to the base frame and the seating frame, the first resilient member is a first spring, the first spring to the elastic deformation supporting the first spring above in the upper side, and the If and the fixed combination of a first upper support, the first support for the first spring in a spring lower side and the upper surface of the seating frame and the fixed combination of a first lower support of the fixed frame included, and the second resilient member is in the second spring, the second upper support and the second said support a second spring in the spring the upper and lower surface of the seating frame with a fixed coupling, the second spring lower side of the elastic deformation the first and the second spring support and provide reinforcement bonding jig including a second fixed lower support in combination with the upper surface of the base frame.
Therefore, the reinforcement and it is possible to guide the vertical movement of the printed circuit board during the adhesion of printed circuit boards to increase the accuracy of the bonding of the reinforcing material and the printed circuit board, in a single bonding operation to bond the reinforcing material to a plurality of printed circuit board it is possible to improve the productivity of products.