The present invention by combining a plating process, the tungsten in the synthetic resin surface, such as resin relates to improving the fracture strength of the resin, more specifically, by molding a synthetic resin containing a conductive filler in the injection process, the prepared blood conductor subject to plating and then subjected to pre-etch the prepared blood conductor so that the filler are exposed to the surface of the to-be-conductors and, and subjected to etching to form a scratch on the surface of the P conductor, by performing a neutralizing neutralizing the etching solution remaining in the blood conductor and give it the sensitivity to the hydrophilic blood conductors by a prior process, the subjected to sensitometric palletizing the blood conductor and sikimyeo subjected to the first active growing a conductive oxide to scratches formed on the surface of the to-be-conductor, the was subjected to the second active further grow the conductive oxide grown on the surface of the to-be-conductor, and that the conductive film is formed on the surface of the to-be-conductor, and subjected to chemical copper plating copper plated film is formed on the conductive film surface, the blood conductor to conduct legacy copper plated film copper sulfate in the copper film surface for, and, and subjected to ternary alloy plating film is formed ternary alloy on the legacy copper film surface, by performing a tungsten-coated synthetic resin to form a tungsten-coated on the membrane surface of said ternary alloy It provides a method for the coating of tungsten on the surface of a conductor formed into a blood injection step.