基本信息:
- 专利标题： 적층 구조체 및 이것에 이용하는 감광성 드라이 필름
- 专利标题（英）：Layered structure and light-sensitive dry film used in same
- 专利标题（中）：层状结构和光敏干胶片用于其中
- 申请号：KR1020127020808 申请日：2011-02-01
- 公开(公告)号：KR101459199B1 公开(公告)日：2014-11-07
- 发明人： 요시다,다까히로 , 미네기시,쇼우지 , 아리마,마사오
- 申请人： 다이요 홀딩스 가부시키가이샤
- 申请人地址： 일본국 도쿄도 네리마쿠 하자와 *쵸메 *반 *고
- 专利权人： 다이요 홀딩스 가부시키가이샤
- 当前专利权人： 다이요 홀딩스 가부시키가이샤
- 当前专利权人地址： 일본국 도쿄도 네리마쿠 하자와 *쵸메 *반 *고
- 代理人： 장수길; 이석재
- 优先权： JPJP-P-2010-025956 2010-02-08
- 国际申请： PCT/JP2011/052002 2011-02-01
- 国际公布： WO2011096385 2011-08-11
- 主分类号： G03F7/004
- IPC分类号： G03F7/004 ; G03F7/095 ; H01L21/027 ; H05K3/28
And at least a substrate (1), in a multilayer structure having an inorganic filler (3) a photosensitive resin layer or a cured coating layer (2) containing a formed on the substrate, the photosensitive possible a coefficient of linear thermal expansion as a whole resin or curing the coating layer by at the same time and can be kept low, no marine degradation, to be excellent in the adhesion to the underfill resin portion and the mold resin part, the the content of the inorganic filler in the photosensitive resin layer or a cured coating layer far surface layer portion from the substrate other It is lower than the portion. In a preferred aspect, in the photosensitive resin layer or a cured coating layer has a content ratio of the inorganic filler comprises a different at least two layers, and the content of the inorganic filler in water photosensitive far surface side from the substrate resin layer or a cured coating layer is another layer It is lower than the content of the inorganic filler. The photosensitive dry film having the photosensitive resin layer is preferably used as a solder resist or an interlayer resin insulating layer of the printed wiring board.
公开/授权文献:
- KR1020120109614A 적층 구조체 및 이것에 이용하는 감광성 드라이 필름 公开/授权日：2012-10-08