基本信息:
- 专利标题: 연마 패드
- 专利标题(英):Polishing pad
- 申请号:KR1020107015876 申请日:2009-02-26
- 公开(公告)号:KR101455218B1 公开(公告)日:2014-10-31
- 发明人: 히로세준지 , 후쿠다다케시
- 申请人: 도요 고무 고교 가부시키가이샤
- 申请人地址: *-*-** Fujinoki, Itami-shi, Hyogo, Japan
- 专利权人: 도요 고무 고교 가부시키가이샤
- 当前专利权人: 도요 고무 고교 가부시키가이샤
- 当前专利权人地址: *-*-** Fujinoki, Itami-shi, Hyogo, Japan
- 代理人: 유미특허법인
- 优先权: JPJP-P-2008-063034 2008-03-12
- 国际申请: PCT/JP2009/053481 2009-02-26
- 国际公布: WO2009113399 2009-09-17
- 主分类号: H01L21/304
- IPC分类号: H01L21/304 ; C08G18/65
Object of the present invention is to provide a polishing pad with excellent stability, polishing rate and excellent durability. The present invention, in the polishing pad is a polishing layer mounted on the substrate layer, the polishing layer is made of a thermosetting polyurethane foam comprising a substantially open-cell of the rectangle having an opening, wherein the thermosetting polyurethane foams, containing an isocyanate component and an active hydrogen group-containing compound as a raw material component, the isocyanate component is diphenylmethane diisocyanate and / or containing the modified product at least 90% by weight, and the active hydrogen group-containing compounds, polycaprolactone 60-98% by weight of a polyol, isocyanate group-containing functional group number of 15 to 40% by weight of the reaction of compound 3, and an isocyanate group concentration is 10 to 15% by weight to the total amount of the isocyanate component with the active hydrogen group-containing compound, the abrasive layer, and the absolute value of the rate of change of the compression ratio a dry and wet state of the compression ratio B [{(BA) / a} × 100] of the polishing pad according to claim 100 or less.
公开/授权文献:
- KR1020100131419A 연마 패드 公开/授权日:2010-12-15