基本信息:
- 专利标题： 표면실장 클립
- 专利标题（英）：Surface-mounting clip
- 专利标题（中）：表面安装夹
- 申请号：KR1020137001929 申请日：2011-06-30
- 公开(公告)号：KR101415224B1 公开(公告)日：2014-07-04
- 发明人： 콘다,켄지 , 쿠리타,토모히사 , 키타노,히로키 , 나카무라,타츠야 , 유미,히데오
- 申请人： 키타가와고우교가부시끼가이샤
- 申请人地址： ***-*, Higashiorido, Mukui-cho, Inazawa-shi, Aichi, Japan
- 专利权人： 키타가와고우교가부시끼가이샤
- 当前专利权人： 키타가와고우교가부시끼가이샤
- 当前专利权人地址： ***-*, Higashiorido, Mukui-cho, Inazawa-shi, Aichi, Japan
- 代理人： 특허법인 남앤드남
- 优先权： JPJP-P-2010-150021 2010-06-30
- 国际申请： PCT/JP2011/065079 2011-06-30
- 国际公布： WO2012002503 2012-01-05
- 主分类号： H05K9/00
- IPC分类号： H05K9/00 ; F16B2/24 ; F16B5/06
Surface mounting clip of the present invention, when the when the solder joints that the solder joint surface to be bonded solder to the conductor pattern of the printed circuit board, in contact one after another to the solder joint, the solder joints have been bonded solder to the printed circuit board with the printing interval can be inserted the other conductive member and the wiring board and the support a pair of the support at a position emerging from the printed circuit board, in contact one after another on at least one of the support of the pair, between the pair of support when the conductive member is inserted, it is elastically deformed by pressure contact to the conductive member, and a resilient contact portion for electrically connecting the conductor pattern and the conductive member.
公开/授权文献:
- KR1020130066658A 표면실장 클립 公开/授权日：2013-06-20
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K9/00 | 设备或元件对电场或磁场的屏蔽 |