基本信息:
- 专利标题： 유량 센서 모듈
- 专利标题（英）：Flow sensor module
- 专利标题（中）：流量传感器模块
- 申请号：KR1020147003025 申请日：2011-09-13
- 公开(公告)号：KR101414755B1 公开(公告)日：2014-07-04
- 发明人： 고노츠토무 , 한자와게이지 , 모리노다케시 , 오카모토유키 , 도쿠야스노보루 , 다시로시노부
- 申请人： 히다치 오토모티브 시스템즈 가부시키가이샤
- 申请人地址： ****, Takaba, Hitachinaka-shi, Ibaraki, Japan
- 专利权人： 히다치 오토모티브 시스템즈 가부시키가이샤
- 当前专利权人： 히다치 오토모티브 시스템즈 가부시키가이샤
- 当前专利权人地址： ****, Takaba, Hitachinaka-shi, Ibaraki, Japan
- 代理人： 문두현; 문기상
- 优先权： WOPCT/JP2010/067946 2010-10-13
- 国际申请： PCT/JP2011/070900 2011-09-13
- 国际公布： WO2012049934 2012-04-19
- 主分类号： G01F1/692
- IPC分类号： G01F1/692 ; G01F1/696
It provides a technique that can suppress the non-uniform performance of each flow sensor. In the flow rate sensor (FS1) according to the present invention, in exposing the semiconductor chip (CHP1) flow rate detection unit (FDU) that is formed in the state, a portion of a semiconductor chip (CHP1) and the capped structure by a resin (MR) is. In the direction parallel to the flow direction of air, whereby the resin in a part of the upper surface (SUR) (CHP) of the semiconductor chip (CHP1) (MR) with a sealing resin than the upper surface (SUR) (CHP) of the semiconductor chip (CHP1) ( the height of the upper surface (SUR) (MR) of the MR) becomes high, thereby stabilizing the flow of air in the flow rate detection unit (FDU). In addition, by increasing the contact area of the semiconductor chip (CHP1) and resin (MR), it is possible to prevent peeling of the interface between the semiconductor chip (CHP1) and resin (MR).
公开/授权文献:
- KR1020140022965A 유량 센서 모듈 公开/授权日：2014-02-25
信息查询:
EspacenetIPC结构图谱:
| G | 物理 |
| --G01 | 测量；测试 |
| ----G01F | 容积、流量、质量流量或液位的测量；按容积进行测量 |
| ------G01F1/00 | 测量连续通过仪表的流体或流动固体材料的流量或质量流量 |
| --------G01F1/68 | .应用热效应 |
| ----------G01F1/684 | ..结构配置；元件安装，例如与液流有关的 |
| ------------G01F1/688 | ...利用特殊类型的加热、冷却或传感元件 |
| --------------G01F1/69 | ....电阻型的 |
| ----------------G01F1/692 | .....薄膜配置 |