基本信息:
- 专利标题： 전자 부품
- 专利标题（英）：Electronic component
- 申请号：KR1020127026799 申请日：2011-04-12
- 公开(公告)号：KR101397761B1 公开(公告)日：2014-05-20
- 发明人： 타카무라,나오키 , 쿠로사와,토루
- 申请人： 야자키 소교 가부시키가이샤
- 申请人地址： 일본 도쿄도 미나토쿠 미타 *쵸메 *반 **고
- 专利权人： 야자키 소교 가부시키가이샤
- 当前专利权人： 야자키 소교 가부시키가이샤
- 当前专利权人地址： 일본 도쿄도 미나토쿠 미타 *쵸메 *반 **고
- 代理人： 허용록
- 优先权： JPJP-P-2010-093347 2010-04-14
- 国际申请： PCT/JP2011/059099 2011-04-12
- 国际公布： WO2011129338 2011-10-20
- 主分类号： H01R12/72
- IPC分类号： H01R12/72 ; H01L27/14 ; H01R12/77 ; H04N5/225
Maintain a good connection state between the connection terminal connected to the circuit board and the circuit board, and electronic components that can reduce the size disclosed. The electronic component (1) is a circuit board (4), a housing (5) having a connection terminal (7) pairs of connection terminals (7) connected pairs and attached to the circuit board (4). Circuit board 4 is provided with a plurality of terminal area 43 connected to the connection terminal (7). Connection terminal (7) is deformable elastically, each connection terminal in the pair, and provided with a spring member 72 is put into the terminal area (43) therebetween. In the housing 5 there is provided a rib 57, the rib is provided between the through-holes through each pair connected to terminals (7), the rib (57) towards the circuit board 4, the circuit board 4 is being formed convex away from the bottom area (56a) of the housing area which is the receiving substrate 56, the rib 57 enters through the plurality of the terminal area (43).
公开/授权文献:
- KR1020120130338A 전자 부품 公开/授权日：2012-11-30