基本信息:
- 专利标题： 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
- 专利标题（英）：Photo-curable and thermo-curable resin composition, and dry film solder resist
- 专利标题（中）：可光固化和热固化树脂组合物，以及干膜阻焊剂
- 申请号：KR1020110024601 申请日：2011-03-18
- 公开(公告)号：KR101361753B1 公开(公告)日：2014-02-12
- 发明人： 정우재 , 최병주 , 최보윤 , 이광주 , 정민수
- 申请人： 주식회사 엘지화학
- 申请人地址： ***, Yeoui-daero, Yeongdeungpo-gu, Seoul, Republic of Korea
- 专利权人： 주식회사 엘지화학
- 当前专利权人： 주식회사 엘지화학
- 当前专利权人地址： ***, Yeoui-daero, Yeongdeungpo-gu, Seoul, Republic of Korea
- 代理人： 유미특허법인
- 优先权： KR1020100025397 2010-03-22
- 主分类号： G03F7/027
- IPC分类号： G03F7/027 ; G03F7/028
The present invention relates to a road, excellent heat resistance and a resin composition and a dry film solder resist having a photocurable and thermosetting dry film that enables the providing of the solder resist having a dimensional stability, etc., indicating a better alkali developability. The resin composition and a carboxyl group (-COOH), an acid-modified oligomer having a photocurable functional group; And is a nitrogen-containing trifunctional or more epoxy acrylate group bonded to the hetero ring, at least one epoxy acrylate groups include a photopolymerizable monomer comprising a compound of the structure which is bonded to a functional group having a carboxyl group; Thermosetting binder having a heat-curable functional group; And a photoinitiator may include.
公开/授权文献:
- KR1020110106237A 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트 公开/授权日：2011-09-28