基本信息:
- 专利标题： 집적 도파관을 구비하는 반도체 패키지
- 专利标题（英）：Semiconductor package including an integrated waveguide
- 专利标题（中）：半导体封装，包括一体化波导
- 申请号：KR1020120108073 申请日：2012-09-27
- 公开(公告)号：KR101355060B1 公开(公告)日：2014-01-24
- 发明人： 보어스,마이클 , 베자드,아리아 , 로포우가란,아마드레자 , 자오,샘 , 카스타네다,지저스
- 申请人： 브로드콤 코포레이션
- 申请人地址： **** California Avenue, Irvine CA ***** U.S.A.
- 专利权人： 브로드콤 코포레이션
- 当前专利权人： 브로드콤 코포레이션
- 当前专利权人地址： **** California Avenue, Irvine CA ***** U.S.A.
- 代理人： 특허법인에이아이피
- 优先权： US13/248,673 2011-09-29
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
The integrated circuits in the integrated circuit and / or the function modules how to communicate over the air between and apparatus are disclosed. Semiconductor device manufacturing operation utilizes a predetermined sequence of the photographic and / or chemical processing steps for forming at least one function module on a semiconductor substrate. Function modules are coupled to an integrated waveguide formed in and / or attached to the ring a semiconductor substrate, to form an integrated circuit. Function modules as well as to communicate with each other, to other integrated circuit, using a multiple access transmitting method in communication via an integrated waveguide. One or more integrated circuits are coupled to an integrated circuit carrier ring, it may form a multi-chip module. Multi-chip module is coupled to the semiconductor package ring, it may form a packaged integrated circuit.
公开/授权文献:
- KR1020130035218A 집적 도파관을 구비하는 반도체 패키지 公开/授权日：2013-04-08
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/52 | .用于在处于工作中的器件内部从一个组件向另一个组件通电的装置 |